SisuSemi
Customers & applications

Wherever silicon has to be better.

ALP™ is a process technology, not a narrow tool — so it adapts across device classes from optoelectronics to memory, and across applications from mobile to quantum.

Customers

Built for every step of the silicon value chain.

Device types & applications
For IDMs

Differentiate chips and lift yield without rewriting your flow.

IDMs manage design and manufacturing. ALP™ helps you tighten defect density, lift reliability, and get more usable chips per wafer.

  • Up to +20% manufacturing yield
  • Lower defect rates, higher performance, longer lifespan
  • Enables volume production of higher-density designs
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For foundries

A measurable edge in a crowded deal market.

Foundries compete against peers and IDM-owned fabs. ALP™ helps you offer lower defect floors, more consistent yield across batches, and stronger reliability.

  • Significant reduction in defect density and leakage current
  • Up to +20% yield — more usable chips per wafer
  • Consistent quality across diverse client specs
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For fabless

Push design limits. Get to market faster.

Fabless teams rely on foundries to hit performance. ALP™ helps your designs hit spec and move through validation with fewer iterations.

  • Faster time-to-market with fewer defects
  • Consistent chip performance from foundry partners
  • Atomic-level cleanliness raises the ceiling on design choices
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Device types

Device classes impacted by atomic-level impurities.

Optoelectronic chips
LEDs, solar cells, photodetectors — where impurities degrade light output and conversion efficiency.
Sensors
Image sensors, MEMS, environmental sensors — where impurities add noise, drift and reduced sensitivity.
Memory chips
DRAM, HBM, NAND Flash, non-volatile memory — where defects hit read/write speed, power and retention.
Processor chips
CPUs, GPUs, ASICs — where atomic-level impurities cause bottlenecks, heat and early failure.
Application areas

From mobile to quantum, cleanliness is the ceiling.

Mobile & wearable
Battery life and thermal management in compact, energy-constrained devices.
IoT
Power efficiency and reliability for devices that run untouched for years.
Data centre
Performance and efficiency for high-compute workloads, with less leakage and lower cooling overhead.
AI, quantum & biotech
Frontier applications where atomic-level cleanliness is a hard requirement, not a nice-to-have.
Next step

Send samples.
See the numbers on your stack.

Pick one of the three published engagements — Components (12 chips), Surface quality (wafers), or Feasibility (wafers on your flow) — and we'll quote scope, timeline and KPIs.

Ask for a quoteRead the technology brief
Mutual NDAKPIs agreed up frontSamples returned